Mini LED Cut

Introduction

-Compatible sizes 2 inches, 4 inches, 6 inches (including DBR coated wafers)

-High precision motion stage

-Special light path design, double focus cutting, high efficiency

-Dynamic focus technology, small depth of cut error

-Wide-angle CCD, can automatically identify and process debris larger than 1cmX1cm

-Automatic loading and unloading system, fully automatic unattended production

-One-key guided operation with barcode reading and production data statistics

-Suitable for workpieces with poor load resistance

-Using dry processing technology, no need to clean

Equipment application scenarios

-Invisible cutting of sapphire substrate LED chip

-The minimum chip size can be 50μm